Production Cycle/Lead Time | 3 weeks standard for Multilayer;
2 weeks standard for Single and/or Double-Sided | 3 day, 7 days, and 2 weeks ** |
PCB Construction Technology | Single sided, Double-Sided, Multi-Layer | Up to 24 layer, Blind Via Buried Via, sequencial build |
Panel Size | 18 x 24” | 24 x 76”> * |
Panel Thickness | .031 – .062” | .005“ – .030, .063 – .400” * |
Substrate Materials | FR4 and/or 185HR glass-filled woven | FR406, FR408, GR, GY, GP, GX, GT, GI glass-filled woven, CEM1, CEM3, Specialty/High Frequency, Roger4003, Polyimide, ceramic filled Teflon, Duroid, N9320-13RF (Neltec), Metal-backed Aluminum, Brass: High Tg Materials include 185HR, IS410; 370HR and NP170 (atavistic) available only upon request* |
Copper Weight (base, ounce/sq.in.) | 0.50, 1, 2, and 3 oz. | 4 oz. base; 5.0+ ounce/sq.in. finished * |
Drilled Hole Size (min.) | .010″ drill (.005~.006″ finished plated) | < .010″ * |
Mechanical Tolerance | +/-.010” positional | +/-.005” positional |
Feature Resolution | .006″ traces , .006″ space (“gap”) | <.004“ traces , <.004” space (“gap”) |
Imagable panel area | 17 x 23″ | >17.5 x 23.5″* |
Front-to-Back Registration | +/-.003″ | +/-.0015″ |
Soldermask (resist) | All boards SMOBC LPI (Green, Red, Blue and Clear) | LPI (any color), Wet (Green. Black, other); Peelable / strippable solder mask; Plugged/capped via; |
Soldermask to land clearance | .004″ (LPI) ; .008″(screenable wet epoxy) | <.004″(LPI) ; <.008″(screenable wet epoxy) * |
Soldermask dam (LPI) | .008″ | .004″ (LPI) * |
Etched feature : artwork deviation | +/-.0007″ (1/2 oz. copper) ; .002″ (1.0 oz. copper) | Please call for specifications on copper weights over 1.0 ounce/sq.in. * |
Plated-thru hole aspect ratio | 5:1 | 12:1 * |
Copper Plating Thickness | .001″ nominal | > .001″ * |
Final Metalic Finishes | Tin-Lead HASL (Hot Air Solder Level),
LEAD-FREE HASL,
White Tin | Immersion Silver
Electrolytic NI
Conductive Carbon ink
“Hard” Gold (Electrolytic)
ENIG (Electroless Nickel/Immersion Gold)
Soft Bondable Gold |
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